Wafer-scale integration of layered 2D materials by adhesive wafer bonding

Quellmalz, Arne; Sawallich, Simon; Prechtl, Maximilian; Hartwig, Oliver; Duesberg, Georg S.; Lemme, Max C.; Niklaus, Frank; Gylfason, Kristinn B.

Bellingham, Washington, USA : SPIE (2022)
Contribution to a book, Contribution to a conference proceedings

In: 2D Photonic Materials and Devices V : 22-27 January 2022, San Francisco, California, United States : 20-24 February 2022, online / Arka Majumdar, Carlos M. Torres Jr., Hui Deng (editors) ; sponsored and published by: SPIE
Page(s)/Article-Nr.: 6 Seiten


  • Chair of Electronic Devices [618710]