Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

Quellmalz, Arne (Corresponding author); Wang, Xiaojing; Sawallich, Simon; Uzlu, Burkay; Otto, Martin; Wagner, Stefan; Wang, Zhenxing; Prechtl, Maximilian; Hartwig, Oliver; Luo, Siwei; Duesberg, Georg S.; Lemme, Max C.; Gylfason, Kristinn B.; Roxhed, Niclas; Stemme, Göran; Niklaus, Frank (Corresponding author)

London] : Nature Publishing Group UK (2021)
Journal Article

In: Nature Communications
Volume: 12
Page(s)/Article-Nr.: 917


  • Chair of Electronic Devices [618710]