Large-Scale Integration of 2D Material Heterostructures by Adhesive Bonding

Quellmalz, Arne (Corresponding author); Wang, Xiaojing; Wagner, Stefan; Sawallich, Simon; Lemme, Max C.; Gylfason, Kristinn B.; Roxhed, Niclas; Stemme, Goran; Niklaus, Frank

Piscataway, NJ : IEEE (2020)
Contribution to a book, Contribution to a conference proceedings

In: MEMS 2020 : the 33rd IEEE International Conference on Micro Electro Mechanical Systems : Vancouver, Canada, January 18-22, 2020 / publisher: IEEE
Page(s)/Article-Nr.: 943-945


  • MICA - Advanced Microelectronic Center Aachen [052600]
  • Chair of Electronic Devices [618710]