Wafer-Scale Transfer of Graphene by Adhesive Wafer Bonding

Quellmalz, Arne (Corresponding author); Wang, Xiaojing; Wagner, Stefan; Lemme, Max C.; Gylfason, Kristinn B.; Roxhed, Niclas; Stemme, Goran; Niklaus, Frank

Piscataway, NJ : IEEE (2019)
Contribution to a book, Contribution to a conference proceedings

In: MEMS 2019 : the 32nd IEEE International Conference on Micro Electro Mechanical Systems : January 27-31, 2019, Coex, Seoul, Korea / publisher: IEEE
Page(s)/Article-Nr.: 257-259


  • Chair of Electronic Devices [618710]