Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding

Quellmalz, Arne (Corresponding author); Sawallich, Simon; Prechtl, Maximilian; Hartwig, Oliver; Luo, Siwei; Wagner, Stefan; Duesberg, Georg S.; Lemme, Max C.; Niklaus, Frank; Gylfason, Kristinn B.

Piscataway, NJ : IEEE (2021)
Contribution to a book, Contribution to a conference proceedings

In: 2021 Conference on Lasers and Electro-Optics (CLEO) : proceedings : virtual conference, May 9-14, 2021 / IEEE


  • Chair of Electronic Devices [618710]