Graphene suspended across a cavity Copyright: © Stefan Wagner

Work Package 6: Sensors

The rapidly increasing use of sensors throughout society, and the demand for cheaper and better devices with less power consumption, depends critically on the emergence of new sensor materials and concepts. Graphene has potential for sensor development within a very wide range of applications because of its large surface area in combination with excellent electrical and mechanical properties. The advantages of graphene-based sensors are that these can furthermore be made very compact and cheap compared to other technologies, paving for example the way for distributed sensor networks that can be used for environmental and health monitoring. Graphene technology could thus result in a wave of cheap and compact sensor devices, with functionalities not seen in existing sensor technology.

Work Package 7: Electronic Devices

The focus of Work Package is set on high frequency electronic devices and circuits, logic switches, ballistic devices, and microwave photonics, involving researchers from material science, device development and modeling, circuit design, RF testing, and modeling in a vertical and interdisciplinary approach. This will enable new and innovative technology solutions for future wireless communication, data processing, 5G, internet of things, low power electronics and sensor systems.

Work Package 10: Wafer-Scale System Integration

The Graphene Flagship has produced a large amount of knowledge, preliminary concepts and devices. Real industrial uptake however requires process scalability to large areas, high quality and reproducible layers and hetero-structures based on graphene and graphene related materials, including functional device demonstrators at industrial level.

We will focus on developing solutions and demonstrations for the wafer scale integration of different technologies, including Photonics and Optoelectronics, Electronics and Flexible Electronics on 300/200mm silicon on insulator and silicon wafers to 150 mm silicon nitride or Quartz and even 100 mm aluminium nitride wafers. The wafer scale developments will be in agreement with applications indicated and developed within the Division Electronics of the Flagship.

The project is funded by the European Union through the Graphene FLAGSHIP.


Robert Bosch GmbH, Germany

Delft University of Technology, Department of Precision and Microsystems Engineering, Netherlands

University of Tartu, Estonia

Universität der Bundeswehr München, Germany

AMO GmbH, Germany

Infineon Technologies AG, Germany

Università di Pisa, Italy

Aalto University, Finland

Technical University of Denmark, Denmark

Technical University Vienna, Austria

Catholic University of Murcia, Spain

Politecnico di Milano, Italy

University of Cambridge, United Kingdom